Interfacial Thermal Stresses in a Bi-Material Assembly with a Low-Yield-Stress Bonding Layer

An approximate predictive model is developed for the evaluation of the interfacial thermal stresses in a soldered bi-material assembly with a low-yield-stress bonding material. This material is considered linearly elastic at the strain level below the yield point and ideally plastic at the higher strains. The results of the analysis can be used for the assessment of the thermally induced stresses in bonding materials in some laser packages and in similar micro- and opto-electronic assemblies.