Mechanicians Meet Engineers: ITherm 2008 Call for Abstracts

ITherm (http://www.ithermconference.org/) and ECTC (http://www.ectc.net/)是两个重要的会议erences in electronic packaging and systems. They are normally located at the same hotel and the same time. The attendees can register for both confercences by paying $100 extra. The total attendance of the two conferences is about 1500. The page counts of the proceedings of the two conferences together is more than 1600 every year. ITherm is more modeling and simulation focused. It is a very good opportunity for mechanicians to meet enigeers in semiconductor industry.

ITherm 2008

Orlando, Florida, May 28-31, 2008

ITherm 2008is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2008 will be held along with the 58th Electronic Components and Technology Conference (ECTC 2008 -http://www.ectc.net), a premier electronic packaging conference. In additon to paper and poster presentations and vendor exhibits, ITherm 2008 will include panel discussions, keynote lectures by prominent speakers, and professional short courses.

It will be held from May 28 - 31, 2008 in Orlando, Florida, USA at the Hilton in Walt Disney World Resort.

ITherm 2008 will feature original papers addressing latest developments in research and technology:

• Thermal Management
• Mechanics
• Emerging Technologies: Thermal, Thermomechanical and/or related underlying multidisciplinary issues
• Panel Discussions
• Poster Sessions

Oral and poster presentations will be featured. The first day of the conference will have short courses. Several keynote speeches on topics of current by experts in the field will be part of the conference program.

Important Dates:

• Deadline for submission of Abstracts - August 17, 2007
• Notification of Abstract Acceptance - September 28 2007
• Draft Paper Submission - December 14, 2007
• Final Paper Submission - March 7, 2008
• ITherm 2008 - May 28 - 31, 2008

Abstract and subsequent paper submissions are entirely web-based, with the above deadlines. Please submit a 400 word text-only (no figures and tables) abstract by clicking below. The Abstracts will be considered for oral or poster sessions. The authors will be informed regarding the session format (poster or stand up) at the time of abstract acceptance.

• To submit your ABSTRACT, ClickHere!
• To submit your DRAFT PAPER, ClickHere!
• To submit your FINAL PAPER, ClickHere!

Additional information on the conference will be posted on these pages in the future.
We hope to bring international experts in the fields of thermal management, mechanical and material aspects in electronic components and systems of pertinence to the current and emerging technologies. We look forward to your participation to make ITherm 2008 lively and intellectually stimulating.

Dr. Tom Lee, General Chair, ITherm 2008, Freescale Semiconductor, 2100 E. Elliot Road, Mail Drop El 725 Tempe, AZ 85284-1806, USA Phone: 480-413-5666, Email:tom.lee@freescale.com

Prof. Yogendra Joshi, Program Chair, ITherm 2008 G. W. Woodruff School of Mechanical Engineering Georgia Institute of TEchnology, Atlanta, GA 30332 USA, Phone: 404-385-2810, Email:yogendra.joshi@me.gatech.edu