iMechanica - Bonded Joints //m.limpotrade.com/taxonomy/term/9254 en 有限元分析模拟双关节在剪切载荷 //m.limpotrade.com/node/21557

Hi all,

I have a question about an FEA simulation. Particularly, about the boumndary conditions that need to be applied to run this simulation.

attempt1:

I fixed the right end of the plates and applied loading to the left end. This resulted in stresses go through only the top joint region (W1 in figure attached).

From our understanding, the deformation is got to be symmetric on both the plates. But, when we applied these BCs, it is not smmetric.

attempt-2:

I applied forces on both the ends as shown on top of the attached image. I contrained 2 nodes on exact middle portions of the plates in X direction. Constrained right most and left most edges where force is applied in Y direction.

The deformation looks pratical, but this is not the best case as we are not letting the plate portion that is constrained in Y direction to deform as result of poisson's ratio.

Any thoughts on this simulation will be beneficial.

Also,

are there any symmetry anti-symmetry conditions that I haven't looked into? Please let me know.

Yuan Krishna

Mon, 04 Sep 2017 00:24:24 +0000 krishna_yuan 21557 at //m.limpotrade.com //m.limpotrade.com/node/21557#comments //m.limpotrade.com/crss/node/21557
Minisymposium: Adhesively Bonded Composite Systems- MECHCOMP2014 , NY //m.limpotrade.com/node/15534 < div class = "字段field-name-taxonomy-vocabulary-6field-type-taxonomy-term-reference field-label-hidden">

30th October 2013
- Deadline for submission of abstracts (a text of 4000 characters max.)

Contributions are
invited for a session on Adhesively bonded composite systems (Session
:39), covering both computational and
experimental aspects of adhesively bonded systems for the 1st International Conference on Mechanics of
Composites (
MECHCOMP2014) that will be hosted by
Stony Brook University (Long Island, New York). The Conference will take
place from 8-12 June 2014. Topics include but not limited to composite joints,
crack-patch repairs, and bonded electronic assemblies

https://sites.google.com/site/mechcomp2014/

After the conference, you can submit a full-length
paper for review and possible publication in Composite Structures (an
international journal by Elsevier).

Sat, 26 Oct 2013 11:53:51 +0000 skumaar 15534 at //m.limpotrade.com //m.limpotrade.com/node/15534#comments //m.limpotrade.com/crss/node/15534