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Description
The selected individual will lead the development, initial application and deployment of new modeling capability in the area of thermoplastic packages. The initial focus is on developing best in class material models across a range of polymers. This material modeling capability will be leveraged globally for a broad range of packaging model applications (blow molding, parison / preform optimization, empty and full bottle interaction with packing lines, etc.)


Job Responsibilities

-This individual will become the lead technical resource from the Modeling & Simulation section interfacing with internal and external resources for material characterization and constitutive material model development.
-This individual will also play a key role connecting with external resources in the area of mechanics of polymeric materials.
The role will require significant innovation in computational approaches, experimentation, and practical application for complex material behavior.
-This role will be responsible, among other things, for the implementation of high fidelity material models to drive highly realistic and accurate simulations. The successful candidate for this role will also lead model validation work to insure the accuracy and robustness of the models that are developed.


Qualifications

-The candidate should have a strong background in solid mechanics and numerical methods. (PhD. in Mechanical Engineering, Engineering Mechanics, Material Science Engineering, Civil Engineering or equivalent field.) Understanding of constitutive material models with experience in building/implementing user-defined constitutive material models into FEA codes would be a benefit. Previous experience with polymer processing is a plus.
-Experience with Numerical Methods in Structural Mechanics, including familiarity with concepts and tools for FEA analysis such as: ABAQUS and/or LS Dyna, CAD, and pre and post processing packages.
-Demonstrated ability to participate in/lead a diverse technical team, and to work through technical and organizational barriers. This role will have responsibilities for influencing and gaining leadership support, interfacing with research organizations & universities, consortiums, and software companies.
-Experience in mechanical test instrumentation and procedures, including designing and / or conducting mechanical testing and model validation. Ideally the successful candidate would have experience with polymeric materials. The ability to handle multiple tasks, work independently and as part of a multi-disciplinary team is required.

Procter & Gamble is an Equal Opportunity Employer. No immigration sponsorship is available for this position. Procter & Gamble does not sponsor candidates for permanent residency except in some areas that in Procter & Gamble's sole discretion require highly specialized backgrounds. Procter & Gamble participates in e-verify as required by law.


Job:
Research & Development


Primary Location:
US-Ohio-Cincinnati


Schedule:
Full-time


Use the following link to apply for ths position:

https://pg.taleo.net/careersection/jobdetail.ftl?job=482516&lang=en

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Sr. Packaging Mechanical Analyst at Apple https://万博manbetx平台m.limpotrade.com/node/13962 < div class = "字段field-name-taxonomy-vocabulary-6field-type-taxonomy-term-reference field-label-hidden">

Sr. Packaging Mechanical Analyst

  • Job Number: 25557504
  • Santa Clara Valley, California, United States
  • Posted: Jan. 3, 2013
  • Weekly Hours: 40.00

Job Summary

Mechanical engineer working in the central IC packaging group.

Key Qualifications

  • Expert in FEA and solid mechanics. Proficent in using Ansys and APDL. Working knowledge in advanced packaging including flip chip, wirebond, stack die and TSV. Strong background in material modeling including solder, polymer based materials. Familiar with heat transfer and multiphysics. Strong coding skills in C++, Fortran, Python, Matlab or Mathematica.
  • Team player. Energetic, self driven and can work under high pressure. Excellent communication skills are must.

Description

Develop FEA models for IC packaging/sensor and subsystems including stress, deflection, fatigue and fracture behaviors. Key player in advanced packaging development by providing support on material modeling & characterization, reliability modeling, mechanical testing and measurement. Drive vendors on modeling methodology development, calibration, measurement.

Education

Minimum MS in Mechanical engineering or related engineering disciplines with 3+ years industry experience.


Submit your resume online at
:

https://jobs.apple.com/us/search?#function&t=1&sb=req_open_dt&so=1&j=HDW...

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