The inaugural Future Faculty Symposium (FFS) will be part of the 60th Society of Engineering Science Annual Conference (SES 2023) at the University of Minnesota in October, please see attached flyer. The goal is to provide a venue for senior PhDs/Postdocs to showcase their reserach and facilitate recruiting dynamics. Please apply here: https://docs.google.com/forms/d/1UkJOIMcAaIDIqv-VEt7oD6bNfv7ywFyOl11KOn_..., and build connections with peers, mentors, and hiring institutions. Thanks to the support of NSF-MoMS, we will sponsor 40 participants with each receiving up to $1000 travel awards.
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On behalf of Texas A&M University & Texas A&M Engineering Experiment Station, we are excited to announce that over 80 symposia in 10 thematic areas have been accepted for the 2022 Society of Engineering Science (SES) Annual Technical Meeting that will be held on our campus in College Station, Texas, from October 16-19, 2022.
We are now accepting abstract submission HERE until May 16, 2022.
Please visit our conference website to learn about the 2022 program. Of specific note, you can find descriptions of each symposium through the thematic areas HERE.
Contact us if you have any questions at ses2022@tamu.edu.
On behalf of Texas A&M University & Texas A&M Engineering Experiment Station, we are excited to announce the 2022 Annual Technical Meeting of the Society of Engineering Science that will be held on our campus in College Station, Texas, from October 16-19, 2022.
CALL FOR SYMPOSIA IS NOW OPEN!
Deadline: January 31, 2022
Please visit our conference website for more information.
2022 SES Conference Organizers
On behalf of Texas A&M University & Texas A&M Engineering Experiment Station, we are excited to announce the 2022 Annual Technical Meeting of the Society of Engineering Science that will be held on our campus in College Station, Texas, from October 16-19, 2022.
CALL FOR SYMPOSIA IS NOW OPEN!
Deadline: January 31, 2022
Please visit our conference website for more information.
2022 SES Conference Organizers
We are happy to announce the 2021 SES Meeting to be held in October. This year’s SES Meeting is an exciting departure from conventional virtual conferences. It will be organized as a Virtual Month (https://socengsci.org/ses-virtual-month/) spread over five days (October 1, 5, 15, 19, and 29). Each day will be a theme, which includes a fishbowl event, presentation, and poster session. A fishbowl is similar to a panel discussion, but with more interaction and informality. We hope this format will provide both scientific knowledge and entertainment for the community. The fishbowl will comprise a moderator and 3-4 panelists who will discuss questions posed by the audience. The themes are as follows:
Size matters (Oct. 1): micro, nano, architected solids, and slender structures.
Living matter (Oct. 5): biosystems, biomaterials, and biofluids.
Interactions matter (Oct 15): coupled-fields, fluid-solid interactions, fluids, and granular and meta-materials.
Soft matter (Oct 19): soft materials and structures, soft robots, and soft meta-materials.
Frontiers matter (Oct 29): advances in mechanics, emerging topics, data-driven mechanics, and the direction and nature of mechanics research in the next 20 years.
The call for poster abstract submission has been launched. You may submit an abstract using the link on the conference webpage: https://socengsci.org/ses-virtual-month/. The deadline for the poster abstract is 1 August 2021. For accepted abstracts, actual poster submission (including a 1-2 minute optional video) will be due by 15 September via a separate link to be provided at a later date.
We look forward to receiving your abstract submissions.
2021 SES Virtual Month Organizing Committee
Shawn Chester (NJIT)
Shelby Hutchens (UIUC)
Shailendra P. Joshi (UH)
Pablo Zavattieri (Purdue)
Kejie Zhao (Purdue)
The Society of Engineering Science (SES) Technical Meeting is held annually to provide an interdisciplinary forum for the exchange of ideas and information among the various disciplines of engineering and the physical and life sciences as well as mathematics. The 55th Annual Technical Meeting of the Society of Engineering Science will be hosted by IMDEA Materials Institute on October 10th-12th, 2018 on the Leganés (Madrid, Spain) campus of the Carlos III University of Madrid. Details on the conference are at the conference website http://www.ses2018.org/.
Important Dates:
December 6, 2017 Submission deadline symposium organization proposal
December 22, 2017 Decision on symposium organization proposals
February 1, 2018 Abstract submission opens
March 31, 2018 Deadline abstract submission
April 30, 2018 Abstract acceptance
July 30, 2018 Registration deadline for presenting authors
October 10-12, 2018 SES 2018 Conference
Dear Colleagues,
The 54th Annual Technical Meeting of the Society of Engineering Science, a joint event with the Applied Mechanics Division of the American Society of Mechanical Engineers, will be hosted by Northeastern University, on July 25-28, 2017 at its Boston campus. As part of this meeting, we are organizing a symposium to address recent experimental, computational, theoretical and manufacturing advances in the research area of Mechanics and Physics of Soft Materials. Topics of particular interest include (but not limited to):
- Electroactive and magnetoactive elastomers (EAP, DE, MRE, MAE)
- Hydrogels and soft wet materials
- Liquid crystal elastomers
- Shape-memory and light-sensitive polymers
- Ionic Polymer-Metal Composites (IPMC)
- Microstructural instabilities, fracture, and adhesion in soft materials
- Soft biological and bio-inspired materials
- Multiphysics phenomena in soft materials
- Wave propagation in soft materials
- 3D/4D printing and fabrication of soft materials
- Soft Robotics or Machines
To submit your abstract, please visit the conference website or abstract submission webpage or click "submit abstract" at the symposium description page
Symposium VII-C: Mechanics and Physics of Soft Materials
The deadline for abstract submission is April 15, 2017.
We look forward to seeing you in Boston this summer!
S. Rudykh, Technion, Israel Institute of Technology
T. Sain, Michigan Technological University
Y. Hu, University of Illinois Urbana-Champaign
O. Lopez-Pamies, University of Illinois Urbana-Champaign
X. Zhao, Massachusetts Institute of Technology
L. Jin, University of California Los Angeles
Dear Colleagues:
We are writing to draw your attention to Symposium II-A, titled "Computational Multiphysics Mechanics of Materials and Structures" within the "Frontiers of Computational Mechanics" track of the 54th Annual Technical Meeting of the Society of Engineering Science (SES) to be held at the Northeastern University, July 25-28, 2017. The symposium description may be found below, and we encourage you to submit an abstract. Fur further details and to submit an abstract, please see the meeting website http://www.northeastern.edu/ses2017/.
Please be aware the deadline for submitting abstracts is Saturday April 15th, 2017.
We look forward to seeing you there,
Christian Linder, Stanford
Steve Sun, Columbia
Shawn Chester, NJIT
Claudio Di Leo, Georgia Tech
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Symposium II-A: Computational Multiphysics Mechanics of Materials and Structures
This symposium is focused on recent research regarding computational modeling related to problems of interest to the mechanics of materials community that involve multi-physics or multiple simultaneous physical phenomena. Researchers are encouraged to submit abstracts in the following (or related) topics: multiphysics coupling; homogenization and concurrent methods; fluid-structure interaction; electro- and magneto-mechanics; geomechanics and/or poromechanics; diffusion and mass transport; hydraulically and/or thermally induced fracturing; failure and instabilities via computational methods.
On behalf of the Board of Directors of SES, we are soliciting nominations to fill 2 positions in the SES Board of Directors. The SES members will elect the directors from the nominees. The Board plays an important role in defining the vision of SES, organizing various SES events, managing society finances, and evaluating nominations for the SES awards. Please nominate your colleagues to serve the Board. All we need are the name of the nominee and 1-2 sentences on why you think he/she might be appropriate for the SES Board. Please send your nomination(s) to Professor Pradeep Sharma (psharma@uh.edu) by April 30, 2017.
The committee picks a subset of all the nominations to put on the election ballot. This year, the committee will select 4-5 candidates from the nomination pool to compete for the 2 vacant board of directors slots.
We note that the SES board members are not eligible to compete for any of the SES medals during their elected term.
With best regards,
Nominating Committee
We would like to invite you to submit an abstract to the symposium F-3: Wave Phenomena in Linear and Nonlinear Metamaterials at the SES 53rd Annual Technical Meeting (SES2016) to be held October 2-5 2016 in College Park, MD.
Symposium Technical Description
Mechanical metamaterials have attracted great interest in recent years because of their unique mechanical properties that exceed those displayed by conventional materials. Some of the most exciting opportunities for metamaterials research are found in the arena of wave propagation, thanks to the ability of metamaterials to induce significant spectral and spatiotemporal manipulation of acoustic and elastic waves. Phononic bandgaps, frequency-dependent directivity, anomalous refractive behavior and subwavelength waveguiding are just some of the most well-known wave manipulation effects. These properties make metamaterials ideal for a variety of engineering applications, including mechanical filtering, energy deflection and trapping and the implementation of a variety of structural logic architectures.
Recently, researchers have focused their attention on metamaterial architectures exhibiting nonlinear behavior. Nonlinearity has been exploited to make acoustic diodes and induce other symmetry breaking effects, as well as a mechanism to achieve tunability and adaptivity and to design programmable structural materials. The field of metamaterials is now rapidly stretching its potential by fully incorporating the latest advances on soft materials, origami-inspired foldable structures and coupled physics phenomena.
In this symposium we welcome contributions that discuss the latest results in acousto-elastic metamaterials research, with special emphasis on works that explore the intimate connection between physics and mechanics. We particularly encourage contributions that discuss metamaterial architectures based on nontrivial material platforms, including granular media, soft lattices, chiral topologies and bucklable and foldable cellular structures.
Symposium Organizers:
K. Bertoldi, Harvard University - bertoldi@seas.harvard.edu
S. Gonella, University of Minnesota - sgonella@umn.edu
We would like to invite you to submit an abstract to the symposium on Mechanics of 3D Printed Materials and Structures at the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) to be held during October 2-5, 2016 at the College Park Marriott Hotel & Conference Center (College Park, MD).
Symposium Technical Description
Additive manufacturing, also known as 3D printing, offers unique opportunities to explore novel properties and mechanics of materials and structures. This symposium calls abstracts from research efforts related to materials and structures with novel mechanical properties/behaviors realized using 3D printing techniques. Specific topics of interest include, but not limited to:
- Metamaterials with novel properties, such as acoustic properties, negative Poisson’s ratio, etc.
- Printed active composites that achieve its actuation through spatially controlling the allocation of active materials
- Novel 3D printing methods that provide unique behaviors/functionalities including stimuli-responsive behaviors
- Design theory or methodology for materials and structures that will be realized through 3D printing
- Mechanics of 3D printed materials, such as their constitutive behaviors, fracture behaviors
- Applications of 3D printed materials and structures
Please be reminded to submit your abstract by June 15, 2016 to Symposium D-3: Mechanics of 3D Printed Materials and Structures to participate in our symposium. Abstract sumission is currently open. You can submit your abstract(s) through the following page (https://www.tavatta.com/cms/index.php?conference=ses&schedConf=ses2016).
Should you have any questions, please feel free to contact us. Thank you for your consideration.
Symposium Organizers:
Sung Hoon Kang, Johns Hopkins University
shkang@jhu.edu
Howon Lee, Rutgers University
howon.lee@rutgers.edu
Yaning Li, University of New Hampshire
yaning.li@unh.edu
Jerry Qi, Georgia Institute of Technology
qih@me.gatech.edu
We would like to invite you to submit an abstract to the symposium on Mechanics of 3D Printed Materials and Structures at the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) to be held during October 4-7, 2016 at the College Park Marriott Hotel & Conference Center (College Park, MD).
Symposium Technical Description
Additive manufacturing, also known as 3D printing, offers unique opportunities to explore novel properties and mechanics of materials and structures. This symposium calls abstracts from research efforts related to materials and structures with novel mechanical properties/behaviors realized using 3D printing techniques. Specific topics of interest include, but not limited to:
- Metamaterials with novel properties, such as acoustic properties, negative Poisson’s ratio, etc.
- Printed active composites that achieve its actuation through spatially controlling the allocation of active materials
- Novel 3D printing methods that provide unique behaviors/functionalities including stimuli-responsive behaviors
- Design theory or methodology for materials and structures that will be realized through 3D printing
- Mechanics of 3D printed materials, such as their constitutive behaviors, fracture behaviors
- Applications of 3D printed materials and structures
Please be reminded to submit your abstract by June 15, 2016 to Symposium D-3: Mechanics of 3D Printed Materials and Structures to participate in our symposium. Abstract sumission is currently open. You can submit your abstract(s) through the following page (https://www.tavatta.com/cms/index.php?conference=ses&schedConf=ses2016).
Should you have any questions, please feel free to contact us. Thank you for your consideration.
Symposium Organizers:
Sung Hoon Kang, Johns Hopkins University
shkang@jhu.edu
Howon Lee, Rutgers University
howon.lee@rutgers.edu
Yaning Li, University of New Hampshire
yaning.li@unh.edu
Jerry Qi, Georgia Institute of Technology
qih@me.gatech.edu
Dear Colleagues,
The 52nd Annual Technical Meeting of the Society of Engineering Science will be hosted by Texas A&M University during October 26-28, 2015. As part of this meeting, we are organizing a mini-symposium to address recent experimental, computational, theoretical, and manufacturing advances on the mechanics and physics of soft materials. Topics of particular interest include:
- Electroactive and magnetoactive elastomers
- Liquid crystal elastomers
- Shape-memory and light-sensitive polymers
- Responsive gels and Ionic Polymer-Metal Composites (IPMC)
- Robust soft materials such as tough hydrogels and elastomers
- Microstructural and material instabilities
- 3D printing of soft materials
- Soft biological tissues and bio-inspired materials
- Wave propagation in Soft Matter
We are writing to invite you to present your work in this symposium. To submit an abstract, please visit the conference website http://ses-2015.org/ and choose
Focus Area III: Mechanics of Soft Materials
Symposium: Mechanics & Physics of Soft Materials
There will also be a related symposium on Soft Mechanical Structures, along with 4 other symposia on related topics (http://ses-2015.org/symposia/). The deadline for abstract submission is July 31, 2015.
We look forward to your participation.
Oscar Lopez-Pamies, University of Illinois Urbana-Champaign
Xuanhe Zhao, MIT
Yuhang Hu, University of Illinois Urbana-Champaign
Stephan Rudykh, Technion, Israel
Symposium Title: “Mechanics & Physics of Soft Materials”
Organizers: Oscar Lopez-Pamies, Xuanhe Zhao, Yuhang Hu & Stephan Rudykh
Sessions: 4
Abstract: Over the past few years, the study of soft materials has driven our community into new exciting directions. Large deformations coupled with non-mechanical fields as well as instabilities of soft materials can be immensely rich. As a result, they offer unique opportunities to design multifunctional materials and devices with novel properties, through the appropriate design of material composition and microstructural layout. This mini-symposium will address recent experimental, computational, theoretical and manufacturing advances in this direction. Topics of particular interest include: (a) Electroactive and magnetoactive elastomers; (b) Liquid crystal elastomers; (c) Shape-memory and light-sensitive polymers; (d) Responsive gels and Ionic Polymer-Metal Composites (IPMC); (e) Robust soft materials such as tough hydrogels and elastomers; (f) Microstructural and material instabilities; (g) 3D printing of soft materials; and (h) Soft biological tissues and bio-inspired materials; (i) Wave propagation in soft matter.
Important dates: Jun. 26: Abastracts due
Jul. 10: Notification of abstract acceptance
Sep. 18: Early registration deadline
For more information, please visit: http://ses-2015.org/
Dear Colleagues:
please consider to attend the symposium titled" Mechanics in Energy Storage and Conversion" as part of the society of engineering science 52nd annual technical meeting to be held at Texas A&M, Oct 26-28, 2015.
This symposium aims to bring together experimental and theoretical researchers working on the issues related to mechanics and electrochemistry of energy materials. More information regarding the symposium and the conference can be found here: http://ses-2015.org/symposia/, under the focus area VII.
Abstracts can now be submitted via the website. Important dates are following:
- June 26, 2015: Abstracts due
- July 10 2015: Notification of abstract acceptance
- September 18, 2015: Early registration deadline
We look forward to seeing you all at the college station!
Symposium Title: “Mechanical Characterization of Soft Materials”
Organizers: Shengqiang Cai (shqcai@ucsd.edu) & Yuhang Hu (yuhanghu@illinois.edu)
Sessions: 2
Abstract:
Soft materials are ubiquitous in nature, from biopolymers, cells, and tissues to organs. In recent years, soft materials have been intensively explored in different engineering applications, ranging from haptic devices to soft robotics, from flexible electronics to biomimetic systems. Fundamental studies of the deformation mechanisms of soft materials and optimal designs in different applications urgently need robust methods for material characterization. The co-organizers: Prof. Yuhang Hu and Prof. Shengqiang Cai have both conducted intensive studies on mechanical characterizations of different soft materials in recent years. Yuhang Hu has developed a new technique based on indentation to characterize the mechanical and transport properties of gels. She also took bio-inspired approach to develop new materials and structures with adaptive optical and wetting properties. Shengqiang Cai has successfully established state of equations of various gels and developed viscoelasticity models of dielectric elastomers under electro-mechanical loadings. In this program, the co-organizers plan to invite both theoretical and experimental studies on mechanical characterization of soft materials such as gels, elastomers and biological materials. We appreciate new techniques that are applied to study the microstructures and macroscopic behaviors of soft materials, advanced models used for material characterizations, and new devices for imaging and measurement. We aim to sharing and advancing our knowledge and technology in this area.
Important dates:
- June 26, 2015: Abstracts due
- July 10 2015: Notification of abstract acceptance
- September 18, 2015: Early registration deadline
For more information, please visit http://ses-2015.org/
Brown University Professor of Engineering Huajian Gao has been selected to receive the William Prager Medal from the Society of Engineering Science (SES) made in recognition of his outstanding research contributions in theoretical solid mechanics. The award will be presented at the 52nd Annual Technical Meeting of the Society of Engineering Science to be held at Texas A&M University, October 26-28, 2015.
The medal is named for former Brown professor William Prager, who helped to establish the Division of Applied Mathematics at Brown in the 1940s.
Of the 22 times the Prager Medal has been awarded, a current or former Brown solid mechanics faculty member or alumnus, has won it ten times. Previous Brown recipients includes: Daniel C. Drucker (1983), Rodney J. Clifton (1986), James R. Rice (1988), George J. Dvorak Ph.D. ’69 (1994), L. Ben Freund (2000), Alan Needleman (2006), Richard James ’74 (2008), Alan Wineman Ph.D. ’64 (2009), Robert M. McMeeking Sc.M. ’74 Ph.D. ’77 (2014) and Huajian Gao (2015). Eight of the ten winners, including Huajian Gao, are also members of the National Academy of Engineering (NAE).
Professor Gao received his B.S. degree from Xian Jiaotong University of China in 1982, and his M.S. and Ph.D. degrees in engineering science from Harvard University in 1984 and 1988, respectively. He served on the faculty of Stanford University between 1988 and 2002, where he was promoted to associate professor with tenure in 1994 and to full professor in 2000. He was appointed as Director and Professor at the Max Planck Institute for Metals Research in Stuttgart, Germany between 2001 and 2006. He joined Brown University in 2006. Professor Gao has a background in applied mechanics and engineering science. He has more than 25 years of research experience and more than 300 publications to his credit. Gao received the Young Investigator Medal from SES in 2005 and was elected to the National Academy of Engineering in 2012.
Professor Gao’s research group is generally interested in understanding the basic principles that control mechanical properties and behaviors of both engineering and biological systems. His research spans over solid mechanics, nanomechanics, and biomechanics. He works on mechanics of thin films and hierarchically structured materials, mechanics of biological and bio-inspired materials, mechanics of nanostructured and nanotwinned materials, mechanics of cell adhesion, mechanics of cell-nanomaterials interactions, mechanics of energy storage systems, and mechanics of metallic glasses.
As part of the 51st Annual Technical Meeting of the Society of Engineering Science (SES 2014) to be held at Purdue University, West Lafayette, IN, on October 1-3 2014, it is our pleasure to invite you to submit an abstract to the Symposium “Issues in computational modeling of damage, fracture and fragmentation of solid materials”.
Computational modeling of damage, fracture, and fragmentation of solid materials is crucial for accelerating the deployment of new material systems into commercial applications. Over the past decades, several numerical approaches have been proposed to address this problem, each of them having advantages and limitations. This symposium will discuss recent advances in the computational modeling of damage, fracture and damage in solids and structures across the scales, making special emphasis on the challenges faced by current approaches such as cohesive elements, XFEM, damage models, and particle methods, as well as the strategies proposed to overcome them. Contributions on applications of modeling of fracture and damage to understand complex multi-scale and multi-physics phenomena are also welcomed.
We would like to invite you, or someone in your group, to submit an abstract. The deadline for the on-line submission is May 31, 2014. Abstracts can be submitted using the following link:
If you have any question or need any information do not hesitate to contact us. We look forward to seeing you at SES in October!
Best regards,
Julian J. Rimoli, Georgia Tech
Glaucio Paulino, University of Illinois
Bo Li, Case Western Reserve University
Call for Abstracts:
Symposium on the
Multiscale Analysis of Nano- and Bio-Structures: From Theory to Numerical Implementation
at the
51st Anual SES Conference at Purdue University (West Lafayette, Indiana, October 1-3, 2014)
The exceptional properties of nanostructures have drawn a new horizon for the future of science. These include low dimensional atomic systems such as graphene sheets and nanotubes and many biological and structural elements such as biomimetic materials, bio-membranes, nanowires, thin films, etc. Multiscale analysis has provided the scientific community with a cost efficient methodology to explore and investigate them with performing full atomistic calculation in non-homogeneous regions and using coarse-grained methods far away from these regions. This symposium will provide a forum for researchers to present research on the advances in multiscale analyses and frameworks common to these diverse materials. Topics include, but are not limited to, theory and computation on:
-
Multiscale analyses of crystalline structure,
-
Multiscale analyses of carbon-based membranes such as graphene and nanotube,
-
Multiscale analyses of biomimetic materials and biological molecules.
Organizers:
Amin Aghaei, Stanford University, amin1@stanford.edu
Kaushik Dayal, Carnegie Mellon University, kaushik@cmu.edu
Click here to submit an abstract.
This is a friendly reminder to draw your attention to the Symposium on **Soft Materials and Structures** to take place at the upcoming 50th Meeting of the Society of Engineering Sciences (SES) at Brown University, Providence, RI (July 28-31, 2013). More information can be found in the meeting's website: http://www.brown.edu/Conference/ses2013/
Over the past few years, soft materials and soft mechanical structures have driven our community into new exciting directions. Large deformations and instabilities of soft materials/structures can be immensely rich, albeit nontrivial. As a result, they offer unique opportunities to design multifunctional materials and devices with novel properties, through the appropriate design of the structural layout. The mini-symposium will address recent experimental, computational and theoretical advances in this direction. Topics of particular interest include:
• Electroactive and magnetoactive elastomers;
• Liquid crystal elastomers;
• Shape-memory and light-sensitive polymers;
• Responsive gels and Ionic Polymer-Metal Composites (IPMC);
• Soft structures including rods, plates, shells and biological structures;
• Geometric and material instabilities;
• Foldable and deployable structures.
The deadline for receipt of abstracts is Monday, April 1, 2013. Abstracts can be submitted using the following link:
http://www.brown.edu/Conference/ses2013/abstract_submission.htm
Please select Soft Materials and Structures as the primary subject area under the track of Mechanics of Solids and Structures to ensure allocation to the correct session.
Pedro Reis, Massachusetts Institute of Technology
preis@mit.edu 6173243325
Xuanhe Zhao, Duke University
xz69@duke.edu
Katia Bertoldi, Harvard University
bertoldi@seas.harvard.edu
Oscar Lopez-Pamies, University of Illinois at Urbana-Champaign
pamies@illinois.edu
Dear Colleague:
The 2013 summer meeting of ASME Applied Mechanics Division will be held jointly with the Society of Engineering Science at Brown University, Providence, RI, July 28-31. We are pleased to invite you to a session on Dynamic Stability of Structural Systems, under the symposium on Instability in Solids and Structures that is being organized by the AMD Technical Committee.
Participation requires just the submission of an abstract by April 1, 2013 (see details at http://www.brown.edu/Conference/ses2013/ .)
The stability symposium is listed under Mechanics of Solids and Structures.
http://www.brown.edu/Conference/ses2013/Symposia/Solids/Instability.htm
Please upload even a tentative abstract, as you will have the opportunity in the next several weeks to finalize your contribution. Please let us know by return e-mail (trivedid@ge.com) of your contribution or inability to participate so that you do not get reminders.
We look forward to your participation at the SES 50th Annual Technical Meeting and the 2013 ASME-AMD Annual Summer Meeting.
Sincerely,
Deepak Trivedi
Session Organizer
Dear Colleagues:
We are writing to invite you to submit abstracts to the symposium "Mechanics of Thin Film and Multilayer Structures" (Symposium IV.11) at the upcoming SES 49th Annual Technical Meeting to be held in Georgia Tech during Oct. 10-12, 2012.
This symposium will encompass recent developments in analytical, experimental and numerical analysis of mechanics of thin film and multi-layer materials. Topics of interests include, but are not limited to stress and deformation in thin films and their measurement, mechanical properties, fracture and fatigue, interfacial delamination, adhesion, hardness, toughness, creep, thin film patterning, mechanical stabilities and reliability.
The objective of this symposium is to provide a forum for researchers from academia, industry and national labs to present, discuss and exchange the latest development in the field.
To submit an abstract, please go to http://ses2012.org/call-for-abstracts, then choose "Multiscale Mechanics of Materials - Mechanics of Thin Film and Multilayer Structures". The deadline for abstract submission is April 2, 2012. Please feel free to forward this information to anyone who might be interested.
Regards,
Jianliang Xiao
Assistant Professor
Department of Mechanical Engineering
University of Colorado
Boulder, CO 80309-0427
Jizhou Song
Assistant Professor
Mechanical and Aerospace Engineering Department
University of Miami
Coral Gables, FL 33143
A symposium on Experimental Multi-Scale Mechanics is being organized for the 2008 SES conference at the University of Illinois at Urbana-Champaign from October 12th through October 15th. The conference website is located at http://ses2008.mechse.uiuc.edu/
To submit abstracts to this symposium please use the abstract submission form and select the symposium title. The deadline for abstract submissions is April 30, 2008.
The aim of the Experimental Multi-Scale Mechanics symposium is as follows:
A key question when probing the mechanics of materials is the effect and the extent of interactions between the atomic through continuum length scales. The goal of this symposium is to provide a forum for the discussion of recent experimental techniques and findings in the multi-scale investigations of the mechanics of materials. Presentations discussing multi-scale phenomena and experimental techniques are particularly encouraged in the following areas; plasticity, fracture analysis, dynamic behavior of materials, phase transformations, and novel methods of multi-scale characterization.
(http://ses2008.mechse.uiuc.edu/content/call_for_abstracts/symposium.php?...)
The organizers for this symposium are Julia Greer (California Institute of Technology) and Sam Daly (University of Michigan).